Deadline extended: IOSCO AMCC member survey on corporate bond market microstructure and participant behaviour

 

21 October 2021 IOSCO Affiliate Members Consultative Committee (AMCC) Bond Market Liquidity Working Party launched in September its market survey on corporate bond market microstructure and participant behaviour. The purpose of the survey is to help to build a picture of corporate bond market microstructures across different regions and to identify different stakeholder behaviours and motivations in times of market stress. This is intended to help inform and complement the work being undertaken by the IOSCO Financial Stability Engagement Group (FSEG) Corporate Bond Market Liquidity Working Group. ICMA, in its role of Chair of the AMCC BML WP, has played a key role in developing this survey.

There are two surveys, one targeted at market-makers and liquidity providers (sell-sides) and one at investor and asset managers (buy-sides). Responses will be collated by the IOSCO AMCC Secretariat and aggregated by relevant region. Responses will remain confidential and all the data will be automatically anonymized. The AMCC BML WP will produce a report of the data to be shared with the IOSCO FSEG and also the AMCC membership. ICMA will make this report available to its members.

ICMA encourages its members active in the corporate bond markets to participate in this important market initiative. The deadline for responding has been extended to 29 October 2021.

The surveys can be accessed here:

Sell-side:
https://www.iosco.org/surveys/2021/amcc-bond-market-liquidity-working-party-sell-side/
 
Buy-side:
https://www.iosco.org/surveys/2021/amcc-bond-market-liquidity-working-party-buy-side/


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